| 摘要 |
<p>A submount to which a semiconductor light emitting element can be fixed surely. The submount (3) comprises a substrate (4), and a solder layer (8) formed on the major surface (4f) of the substrate (4). The solder layer (8) has a surface roughness Ra not larger than 0.18 μm before melting. Surface roughness Ra of the solder layer (8) is preferably not larger than 0.15 μm, and more preferably, not larger than 0.10 μm. A semiconductor device (1) comprises a laser diode (2) mounted on the solder layer (8) of the submount (3).</p> |
