| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a monolithic microwave integrated circuit chip package for employing a flip-chip packaging technology that a mismatching of reactance caused by a parasitic capacitance or parasitic inductance and self-resonance can be minimized, and heat dissipation from the monolithic microwave integrated circuit can be increased. <P>SOLUTION: The monolithic microwave integrated circuit chip package is equipped with a package substrate, monolithic microwave integrated circuit chips, a plurality of projections, and a plastic package body, and has a thermal VIA inside. An array of bonding pads of the ground-signal-ground or the ground- signal on the monolithic microwave integrated circuit chips is transmitted to an electrical contact outside the package, thereby, the monolithic microwave integrated circuit chips inside the package can be operated under optimum conditions. <P>COPYRIGHT: (C)2003,JPO |
