| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a boat for heat treatment in which a contact stress being applied from the wafer mounting part of the boat to a wafer is relaxed when the wafer is held horizontally in a vertical heat treatment system and slip dislocation does not take place at the time of heat treatment even after use of a long time. <P>SOLUTION: The boat for heat treatment comprises a plurality of columns and a coupling part thereof, and a plurality of wafer mounting parts disposed at the same height as the columns wherein at least the part of each wafer mounting part touching the wafer is composed of a soft member, and the wafer is heat treated while being supported by the soft member. <P>COPYRIGHT: (C)2003,JPO</p> |
