| 摘要 |
PROBLEM TO BE SOLVED: To achieve mounting including sealing with high productivity with high reliability by filling a sealing material between objects to be mounted without involving bubbles simultaneously at the mounting of an electronic component. SOLUTION: A method for mounting the electronic component comprises steps of drawing and coating the sealing material 31 along sealing material coating lines 31a to 31d so as to cross at a center and radially extend from the center toward a periphery at least at one of the protruding electrode disposing surface of the component and the mounting surface of the object to be mounted, and bringing a protruding electrode of the component into contact with an electrode of the object to be mounted by aligning the component at the object, filling the material 31 in the gap between the component and the object, then imparting connecting energy to the component while loading a pressing load to the component, and connecting the protruding electrode to the electrode of the object to be mounted. COPYRIGHT: (C)2003,JPO |
