| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a ceramic circuit board formed by bonding a metal plate to each side of a ceramic board is warped. SOLUTION: This manufacturing method comprises a first process of bonding metal plates 1 and 3 having the nearly some thicknesses to bath main surfaces of a ceramic board 2, second process of forming a resist film 4 into a circuit pattern on the surface of the metal plate 1 on the one main surface of the ceramic board 2 and depositing a resist film 5 on the whole surface of the metal plate 3 on the other main surface of the ceramic board 2, third process of forming a circuit corresponding to the circuit pattern resist film 4 by etching the metal plate 1 on the one main surface of the ceramic board 2, fourth process of separating the resist film 4 formed on the whole surface of the metal plate 3 on the other main surface of the ceramic board 2, fifth process of etching the whole surface of the metal plate 3 on the other main surface of the ceramic board 2 to a desired thickness, and sixth process of separating the circuit pattern resist film 4 deposited on the surface of the metal plate 1 on the one main surface of the ceramic board 2. COPYRIGHT: (C)2003,JPO
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