| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for measuring the flatness of a wafer in a non- contact and non-destructive manner and managing the wafer. SOLUTION: The method for measuring the flatness of the semiconductor wafer comprises a step of measuring the reflecting intensity of the wafer, a step of taking data of the flatness and reflecting light intensity based on reflecting intensity, a step of forming grooves at predetermined intervals (line and space) on a first layer on a semiconductor substrate, a step of forming a second layer for flattening the step of forming the grooves of the first layer, and a step of measuring the step of forming the grooves by using an optical system. COPYRIGHT: (C)2003,JPO
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