发明名称 COOLING DEVICE AND THERMAL TREATING DEVICE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a cooling device with a light weight, and a high cooling efficiency and reliability. SOLUTION: A cooling device 108 is provided in a thermal treating device 50 which is subjected to a predetermined thermal treatment for a workpiece W in a treating envelop 56 heated by a heating means 89. The cooling device 108 comprises a cooling cylindrical part 110 of a cylindrical shape disposed surrounding the treating envelop containing the heating means, a cooling pipe member 112 wound on a side surface of the cooling cylindrical part and soldered on the side surface, and a refrigerant supply means 114 for supplying a refrigerant to the cooling pipe member for circulation. Thus, since the cooling pipe member itself has only to have a pressure resistance to a refrigerant pressure, it is possible to decrease the thickness of the cooling pipe member itself and to decrease considerably the weight of the overall cooling device. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003257872(A) 申请公布日期 2003.09.12
申请号 JP20020054543 申请日期 2002.02.28
申请人 TOKYO ELECTRON LTD 发明人 SAITO TAKANORI;YAMAGA KENICHI
分类号 F27B5/04;F27B5/06;H01L21/00;H01L21/205;H01L21/22;H01L21/302;H01L21/31;(IPC1-7):H01L21/205;H01L21/306 主分类号 F27B5/04
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