发明名称 METHOD AND APPARATUS FOR CHEMICAL-MECHANICAL POLISHING, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To enhance the efficiency of chemical-mechanical polishing without requiring a complicated or a large scale facility, and without changing stable polishing conditions in the chemical-mechanical polishing. <P>SOLUTION: This method for the chemical-mechanical polishing comprises a process (a) for heating the temperature of a polishing cloth up to a prescribed temperature by supplying temperature-adjusted liquid such as pure water which is pre-heated to a prescribed temperature, and a process (b) for polishing a workpiece by the chemical-mechanical polishing while supplying slurry over the polishing cloth. The chemical-mechanical polishing is progressed promptly. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003257914(A) 申请公布日期 2003.09.12
申请号 JP20020051350 申请日期 2002.02.27
申请人 FUJITSU LTD 发明人 HORIUCHI HIROSHI;YAMAMOTO TAMOTSU;NAKANO KENJI
分类号 B24B37/015;H01L21/304 主分类号 B24B37/015
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