PACKAGE STRUCTURE FOR SEMICONDUCTOR CHIP

摘要

PROBLEM TO BE SOLVED: To provide a package structure for a small-sized semiconductor chip having high heat dissipation.

SOLUTION: A chip counterbore 11 is made in a lead frame 1. A hollow groove 13 is made around the chip counterbore 11 and connected with the lead frame 1. A board 3 is applicable to manufacturing of a high integration density circuit and can satisfy the need for a large number of pins count. Pins are arranged at corresponding positions in the hollow groove 13 of the lead frame 1 and bonded by means of a gold wire 22. A chip 2 is bonded to the chip counterbore 11 of the lead frame in the forward direction through a bond 23. The gold wire 22 is connected with the electrical conduction pin of the board 3. Since heat generated through operation of the chip 2 is dissipated from the chip counterbore 11 to the outside, a large heat dissipation effect is attained. Since the package structure for a semiconductor chip requires neither copper plate nor a heat dissipating plate, the volume can be reduced.

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