| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a circuit integration type molding with which a noise countermeasure component can be omitted or simplified, an electronic device can be small-sized furthermore, and the assembly performance can be enhanced, and to provide a manufacturing method thereof. <P>SOLUTION: In the circuit integration type molding by directly patterning a conductor film on the molding to integrate a circuit and the manufacturing method thereof, the molding is configured with a resin material having an electromagnetic wave absorbing characteristics. <P>COPYRIGHT: (C)2003,JPO</p> |
