| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface acoustic wave device where the package size in thickness direction is decreased and the strength of the package is enhanced. SOLUTION: The surface acoustic wave device includes: a ceramics planar base substrate; a ceramics frame of a ring shape extended vertically from the outer circumference of the ceramics planar base substrate; a surface acoustic wave element mounted on the ceramics planar base substrate at the interior of the ceramics frame; and a metallic cover adhered to the end of the ceramics frame. COPYRIGHT: (C)2003,JPO
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