| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that, even if a silicone anti-foaming agent is not contained, a pinhole or a void is not formed in a solder resist layer. SOLUTION: A film carrier tape for mounting an electronic component comprises a desired wiring pattern formed on the surface of an insulating film, and a solder resist layer formed on a part except a lead of the pattern. The solder resist layer contains at least one type of a resin component selected from among groups of elastomer modified materials of an epoxy resin, an urethane resin, elastomer modified materials of the urethane resin, a polyimide resin and elastomer modified materials of the polyimide resin, does not contain the silicone anti-foaming agent, and a cured layer of a solder resist coated layer obtained by coating deaerated coating liquid in a range of 15 to 50μm. COPYRIGHT: (C)2003,JPO
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