| 摘要 |
PROBLEM TO BE SOLVED: To provide a printing method of conductive paste which can form a bump without high hardness, cracks and connection defect to a wiring pattern by holding a stable bump height in continuous swirl printing, and a printed wiring board using the method. SOLUTION: In this method, a bump is formed on a board by using conductive paste comprising one or more selected from among at least melamine resin, phenol resin and epoxy resin, conductive powder, solvent and dihydric alcohol and/or trihydric alcohol. Conductive paste is printed by controlling the concentration of alcohol in the total amount of solvent and alcohol at 1 to 50% by mass at a temperature in the range of 15 to 25°C. COPYRIGHT: (C)2003,JPO
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