COMPOSITION FOR FORMING SILICA-BASED FILM, AND SILICA-BASED FILM AND METHOD OF FORMING THE SAME, AND ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a composition for forming a silica-based film which allows the formation of a film having a low dielectric constant and sufficiently high mechanical strength and which is capable of preventing the abrupt application of stress when forming the film. SOLUTION: The composition for forming a silica-based film comprises (a) a siloxane resin such as an alkoxysilane, (b) a solvent such as an alcohol which can dissolve the siloxane resin, (c) an ammonium salt or the like, and (d) a pyrolytic volatile compound. The composition has a maximum value for stress near 300°C in a temperature-pressure curve which indicates a hardening characteristic. COPYRIGHT: (C)2003,JPO