| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer etching apparatus which can improve an etching rate better than that of a prior art, can perform every etching process by a wet etching method with higher accuracy and can further include a chemical solution collecting system. SOLUTION: This semiconductor wafer etching apparatus includes a shingle sheet type rotating disk or a batch type rotating disk for two or more wafers, is provided with a supply port and a slit for supplying the chemical solution for etching in a manner to cancel the distribution of pressure of the chemical solution on the rotating disk and also includes a line to pressurize an etching vessel. COPYRIGHT: (C)2003,JPO
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