| 摘要 |
PROBLEM TO BE SOLVED: To improve products in manufacturing yield by reducing influence of irregularities in a line width of a pattern formed on a reticle so as to form the pattern having a uniform line width on a wafer, in a process of forming a prescribed pattern by transferring a pattern formed on the reticle onto the wafer by the use of photography. SOLUTION: The irregularities in the line width of the pattern formed on the reticle 6 are measured, an exposure value which sets the line width of the pattern formed on the reticle 6 equal to the desired line width of a device pattern formed on a wafer 7 is obtained, and the wafer 7 is subjected to an exposure process as the exposure value is controlled corresponding to the irregularities. COPYRIGHT: (C)2003,JPO
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