| 摘要 |
PROBLEM TO BE SOLVED: To reduce dispersion of measured temperature in individual temperature measuring elements as much as possible in the temperature measuring element used for temperature adjustment of a soaking plate in a wafer heater. SOLUTION: A heat generating resistor is formed on the surface of a ceramic plate or therein, and a recessed part is formed from the opposite side of a heating surface for heating an object to be heated to the heating surface, and a thermocouple for controlling temperature of the ceramic plate is provided in the recessed part. In a wafer heater provided with such a structure, a diffusion layer at the temperature contact part of the thermocouple is made 0.5 to 10 times the diameter of a wire in thickness. COPYRIGHT: (C)2003,JPO
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