发明名称 CONDUCTIVE RESIN PASTE AND CONDUCTIVE RESIN MEMBRANE
摘要 PROBLEM TO BE SOLVED: To provide a conductive resin paste that can form efficiently a conductive resin membrane (electrode membrane) having good conductivity by securing electrical contact between the conductive metal powder in the conductive resin membrane (electrode membrane), and a conductive resin membrane. SOLUTION: The conductive resin paste has a composition which contains a conductive metal powder that is formed in flat shape by combining or coagulating a metal powder having an average particle size D50 in the range of 0.05-0.5μm and a resin. And as the conductive metal powder, the conductive metal powder satisfying each of the conditions of average thickness: 0.1-1μm, average value of the maximum diameter: 2-10μm, and aspect ratio: 5 or more is used. And as the metal powder constituting the conductive metal powder, a silver powder having small electrical resistance is used. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003257244(A) 申请公布日期 2003.09.12
申请号 JP20020053293 申请日期 2002.02.28
申请人 MURATA MFG CO LTD 发明人 NAGAKUBO HIROSHI;OYA HIROHISA
分类号 C08K3/08;C08K7/18;C08L101/00;C09D5/24;C09D7/12;C09D201/00;H01B1/00;H01B1/22;(IPC1-7):H01B1/22 主分类号 C08K3/08
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