| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed wiring board pad of high accuracy at a low cost in a short delivery time, which is capable of preventing a printed wiring board from being warped when cream solder is printed on the rear opposite to the surface of the siring board where electronic components are mounted or when the electronic components are mounted, printing the cream solder well, and surely mounting the components when the double-sided mounting printed wiring board is manufactured. <P>SOLUTION: The printed wiring board pad 1 is composed of a plurality of support plate members 13 to 24 of which the parts abutting against the printed wiring board 3 are 0.1 to 5 mm in widths, without warping the printed wiring board 3 mounted with electronic components 4 to 46 on its one surface and all equal to each other in height, a pinching member 12 having silt-shaped through-holes for pinching and keeping the support plate members 13 to 24 in an upright position, and a hard pad 11 which holds the support plate members 13 to 24 in an upright position. <P>COPYRIGHT: (C)2003,JPO |
