| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of forming a coating film which is capable of improving a throughput by shortening the application time of treatment liquid. <P>SOLUTION: The method of forming a coating film comprises a process of applying treatment liquid composed of a solvent and one or two treatment liquids for forming a coating film on a wafer W and a process of removing the solvent and forming a coating film by performing a baking process to the wafer W applied with the treatment liquids. In the process of applying the treatment liquids on the wafer W, the treatment liquids are supplied on the wafer W while the wafer W is held nearly horizontal and turned, and after diffusing the treatment liquids, the wafer W thereon the treatment liquids are diffused is turned into a stationary state to separate the treatment liquids in a vertical direction. <P>COPYRIGHT: (C)2003,JPO |
