| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic device in which electrical energization can be assured without expanding a mounting region, and to provide a method for manufacturing the same and electronic equipment. <P>SOLUTION: The method for manufacturing the electronic device comprises steps of electrically connecting first wiring 22 to a first electrode group 12 of an integrated circuit chip 10, and then electrically connecting second wiring 32 to a second electrode group 14 of the chip 10. The pitch of the group 12 is set wider than that of the group 14. A first support member 20 has a large deformation ratio due to either heat and moisture from a second support member 30. <P>COPYRIGHT: (C)2003,JPO</p> |
