发明名称 INSULATION DEFECT DETECTING METHOD OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a detecting method for detecting simply and rapidly an insulation defect between insulated wired conductors formed in a semiconductor device. SOLUTION: In a semiconductor memory 100 in which wired conductors 11 and 13 that are different in metal content rates are juxtaposed to each other, upper layers of the wires conductors 11 and 13 are removed, and more than two of the wired conductor 11 are connected electrically to be immersed in etching liquid 7, so that the wired conductor 13a is removed in the absence of an insulation defect between wired conductors, while a passivated film 21 is formed on the wired conductor 13a in the presence of an insulation defect portion 3 between the wired conductors, making the wired conductor 13a left. The insulation defect between the wired conductors is detected by the presence or absence of the wired conductor 13a. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003258053(A) 申请公布日期 2003.09.12
申请号 JP20020057299 申请日期 2002.03.04
申请人 MITSUBISHI ELECTRIC CORP 发明人 TOYODA RUI;ISHII HIROYUKI;YAMADA TOMOKO
分类号 H01L21/66;H01L21/3205;H01L23/52;(IPC1-7):H01L21/66;H01L21/320 主分类号 H01L21/66
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