| 摘要 |
PROBLEM TO BE SOLVED: To provide a spinning treatment apparatus which can prevent the leak of an atmosphere in a treatment vessel to an external side and the entry of external air when a semiconductor wafer is carried into the treatment vessel or carried out to the external side. SOLUTION: The spinning treatment apparatus comprises a treatment vessel 1 provided with a semiconductor wafer entrance 34 which is opened and closed by a shutter 35, a cup body 2 provided in the treatment vessel, a rotating table 16 which is driven to rotate while it is provided in the cup body and holding semiconductor wafers, a fan filter unit 32 for guiding clean air into the treatment vessel provided at the upper part of the treatment vessel, an exhaust pump 6 to exhaust the clean air supplied to the treatment vessel from the fan filter unit, and a path 26 for controlling the amount of the clean air supplied to the treatment vessel and the amount of the clean air exhausted from the cup body to keep pressure in the treatment vessel to almost the atmospheric pressure when the semiconductor wafers are carried in and out to and from the treatment vessel by opening the entrance 34. COPYRIGHT: (C)2003,JPO
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