| 摘要 |
PROBLEM TO BE SOLVED: To improve in-plane uniformity of the quality of a resist film by heat treatment performed on a substrate coated with a resist solution before exposure. SOLUTION: The substrate coated with the resist solution is placed on a heating plate in a processing chamber, a purge gas is supplied to the processing chamber, and, at the same time, the heating of the substrate is started. A film thickness detecting sensor which monitors the thickness of the resist film formed on the surface of the substrate is provided above the placed position of the substrate and, when the thickness of the resist film becomes a fixed value or smaller, a control section raises lifter pins so as to increase the distance between the substrate and heating plate. Consequently, the quantity of heat received by the substrate decreases and, thereafter, only a solvent volatizes from the resist film without effecting the polymer contained in the film. COPYRIGHT: (C)2003,JPO
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