| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component preventing the erection of a chip at the time of reflow and improving the mounting properties and a mounting structure. SOLUTION: The electronic component is provided with a columnar substrate 1, a pair of external electrodes 3 that are provided at both end parts of the substrate 1, a conductive member 2 that is buried in the substrate 1 and electrically connected with a pair of external electrodes 3 respectively and an external conductor 10 that is out of contact with the external electrodes 3 on the side of the substrate 1. COPYRIGHT: (C)2003,JPO
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