发明名称 |
Metal or metal alloy based sputter target and method for the production thereof |
摘要 |
The invention concerns a sputter target on a metal or metal alloy base with a melting point of not more than 750° C., especially tellurium alloy, with a microstructure of powder particles compacted by means of powder metallurgy, where the primary microstructure of the powder particles is very fine as compared with their size and where the particle size is clearly greater than the grain size of the primary microstructure.
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申请公布号 |
US2003168333(A1) |
申请公布日期 |
2003.09.11 |
申请号 |
US20030257118 |
申请日期 |
2003.05.08 |
申请人 |
SCHLOTT MARTIN;HEINDEL JOSEF |
发明人 |
SCHLOTT MARTIN;HEINDEL JOSEF |
分类号 |
B22D25/02;B22F9/08;B22F9/10;C22C12/00;C22C13/00;C22C18/00;C22C28/00;C23C14/34;(IPC1-7):C23C14/32;B22F1/00;B22F1/02;C22C21/00;C23C14/00;C25B9/00;C25B11/00;C25B13/00 |
主分类号 |
B22D25/02 |
代理机构 |
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地址 |
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