发明名称 |
Power semiconductor module with ceramic substrate |
摘要 |
A power semiconductor module is presented in which terminal elements are press-fitted into openings in a plastic housing. This measure improves the reliability of the internal bonds between the substrate and the terminal element since there is no longer a risk of the terminal elements loosening in the plastic housing.
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申请公布号 |
US2003168724(A1) |
申请公布日期 |
2003.09.11 |
申请号 |
US20030429605 |
申请日期 |
2003.05.05 |
申请人 |
SIEMENS AG |
发明人 |
LENNIGER ANDREAS;FERBER GOTTFRIED;KEMPER ALFRED |
分类号 |
H01L23/24;H01L23/498;(IPC1-7):H01L23/52 |
主分类号 |
H01L23/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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