| 摘要 |
A method of film laminating which comprises superposing an adhesive film comprising a base film and a resin composition layer on a circuit board so that the resin composition layer is in contact with at least the pattern-bearing part thereof, pressing the adhesive film against the circuit board with a laminating apparatus having a press plate made of a heat-resistant rubber, and then pressing the resultant structure with a laminating apparatus having a press plate made of a metal; and the method of film laminating in which the adhesive film comprising a base film and formed thereon a resin composition layer having a melt viscosity at 120° C. of 10,000 to 100,000 Pa s is superposed on the circuit board so that the resin composition layer overlies at least the circuit pattern part thereof, and the adhesive film is laminated to the circuit board with a press plate and an underlay plate which has a modulus at 120° C. of 1 to 500 MPa and is disposed between the press plate and the base film of the adhesive film. Thus, a multilayer circuit board is obtained which is excellent in buried-layer state and surface smoothness.
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