发明名称 |
Data processing apparatus for semiconductor processing apparatus |
摘要 |
A data processing apparatus for a semiconductor manufacturing apparatus includes a semiconductor manufacturing apparatus for executing processing for a wafer, a data collecting semiconductor device for collecting processing data generated in association with the processing, and a data copying semiconductor device for extracting the processing data collected in the data collecting semiconductor device and for producing a copy of the processing data. The apparatus may include a data analyzer for analyzing the data copy produced by the data copying semiconductor device and for diagnosing a processing state of the processing apparatus.
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申请公布号 |
US2003168171(A1) |
申请公布日期 |
2003.09.11 |
申请号 |
US20020087982 |
申请日期 |
2002.03.05 |
申请人 |
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发明人 |
TANAKA JUNICHI;MASUDA TOSHIO;KAGOSHIMA AKIRA;IKUHARA SHOJI;YAMAMOTO HIDEYUKI |
分类号 |
H01L21/00;H01L21/66;(IPC1-7):C23F1/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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