发明名称 Data processing apparatus for semiconductor processing apparatus
摘要 A data processing apparatus for a semiconductor manufacturing apparatus includes a semiconductor manufacturing apparatus for executing processing for a wafer, a data collecting semiconductor device for collecting processing data generated in association with the processing, and a data copying semiconductor device for extracting the processing data collected in the data collecting semiconductor device and for producing a copy of the processing data. The apparatus may include a data analyzer for analyzing the data copy produced by the data copying semiconductor device and for diagnosing a processing state of the processing apparatus.
申请公布号 US2003168171(A1) 申请公布日期 2003.09.11
申请号 US20020087982 申请日期 2002.03.05
申请人 发明人 TANAKA JUNICHI;MASUDA TOSHIO;KAGOSHIMA AKIRA;IKUHARA SHOJI;YAMAMOTO HIDEYUKI
分类号 H01L21/00;H01L21/66;(IPC1-7):C23F1/00 主分类号 H01L21/00
代理机构 代理人
主权项
地址