发明名称 |
EINGEKAPSELTES MATERIAL MIT KONTROLLIERTER FREISETZUNG |
摘要 |
An encapsulated material is described of which at least a part of the material is kept encapsulated during heat treatment in an aqueous environment and is released during cooling after a heat treatment. The material is encapsulated in a layer of a hydrophobic film-forming material and a layer of a material having a low critical solution temperature (LCST) below the treatment temperature. The layer containing the hydrophobic material may be situated inside the layer having the LCST and have a melting point below the LCST, but it may also be situated outside the layer having the LCST and have a melting point above the LCST of said layer. Said layers may also be applied together. |
申请公布号 |
DE69810608(T2) |
申请公布日期 |
2003.09.11 |
申请号 |
DE1998610608T |
申请日期 |
1998.05.01 |
申请人 |
HENKEL KGAA |
发明人 |
VAN VILSTEREN, EVERDINA;NEERHOF, JAN;SCHIJVENS, PAULUS;DELNOYE, ANDRE;JONGSMA, TJEERD |
分类号 |
A23L1/00;A23L1/187;A23L1/22;A23L1/237;A23P1/04;A23P1/08;A61K9/28;A61K9/42;A61K9/50 |
主分类号 |
A23L1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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