| 摘要 |
A decomposition type resin having the formula (I): wherein R' and R'' are acrylic series polymers or norbornene series polymers, R''' is divalent C1-20 linear or branched alkyl, C3-20 cyclic alkyl, C1-6 linear, branched or cyclic alkoxy, silyl, or alkylsilyl. The decomposition resin can be used to prepare photoresists. The contrast of the photoresist before and after exposure is increased, and the resolution is enhanced.
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