发明名称 Electronic component cooling apparatus
摘要 A cooling apparatus has a heat sink that has a plurality of fins on the top face of a heat transfer plate opposed to a heat-generating body to be cooled in contact therewith. Comb-like baffle plates or raised baffle plates are inserted between the fins of the heat sink. This structure improves heat dissipation characteristics.
申请公布号 US2003168208(A1) 申请公布日期 2003.09.11
申请号 US20030379800 申请日期 2003.03.06
申请人 SATO KAORU 发明人 SATO KAORU
分类号 H01L23/467;(IPC1-7):F24H3/06 主分类号 H01L23/467
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