| 摘要 |
A semiconductor device comprises a substrate, a mounting chip, multi-stage bumps, and a sheet-like interposer member. The mounting chip is bonded to the substrate. The multi-stage bumps have two or more stages of bumps stacked and bonded so that the substrate and the mounting chip are electrically connected by the multi-stage bumps. The interposer member is of a resin material and provided in the stacked stages of the multi-stage bumps. The interposer member has openings each formed between two diagonally arrayed bumps of the multi-stage bumps.
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