| 摘要 |
Aspects for routing in multilayer ceramic substrates that reduces via depth and avoids via bulge are described. The aspects include providing a multilayer ceramic substrate with at least two redistribution layers. Vias for each of a plurality of signal lines are jogged on at least a second redistribution layer of the at least two redistribution layers. Further, the aspects include providing the second redistribution layer no more than seven layers deep in the multilayer ceramic substrate. |
