发明名称 Method and apparatus for evaluating insulating film
摘要 There is provided a method for evaluating an insulating film entirely provided on a conductor layer for the characteristics or dimensions thereof. A measuring member having conductor bumps arranged thereon to be connected to wires is disposed above the insulating film on the conductor layer. Then, the conductor bumps are pressed against the insulating film with a given pressing force. By applying a voltage (electric stress) between the conductor bumps and the conductor layer, the characteristics including I-V characteristic, gate leakage current, and TDDB or the dimensions including thickness are evaluated.
申请公布号 US2003169065(A1) 申请公布日期 2003.09.11
申请号 US20030385848 申请日期 2003.03.12
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 ERIGUCHI KOJI;HASHIMOTO YUKIKO;WATAKABE AKIO
分类号 H01L21/66;H01L23/544;(IPC1-7):G01R31/26 主分类号 H01L21/66
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