发明名称 Weak-magnetic field sensor using printed circuit board manufacturing technique and method of manufacturing the same
摘要 A weak-magnetic field sensor using printed circuit board manufacturing technique which detects the Earth's magnetic field to obtain positional information, and a method of manufacturing the same is disclosed. The sensor comprises a first base board which is formed at its upper and lower surfaces with first driving patterns and first pickup patterns, a pair of first stacked boards which are stacked on upper and lower surfaces of the first base board and which are formed with magnetic layers thereon, and a pair of second stacked boards which are stacked on outer surfaces of the pair of first stacked boards and which are formed with second driving patterns and second pickup patterns electrically connected to the first driving patterns and the first pickup patterns of the first base board to surround magnetic layers. The magnetic layer, the driving patterns and the pickup patterns provided on the first base board are oriented to be perpendicular to those provided under the first base board.
申请公布号 US2003169037(A1) 申请公布日期 2003.09.11
申请号 US20020139356 申请日期 2002.05.07
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KANG MYUNG-SAM;NA KYOUNG-WON;CHOI SANG-ON;CHOI WON-YOUL;LEE JEONG-HWAN;PARK KEON-YANG
分类号 G01R33/02;G01C17/30;G01R33/05;H01F17/00;H01F41/04;H05K1/16;(IPC1-7):G01R33/04 主分类号 G01R33/02
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