发明名称 Ferroelectric memory device using via etch-stop layer and method for manufacturing the same
摘要 A ferroelectric memory device and a method for manufacturing the same. The ferroelectric memory device comprises a lower interlayer insulating layer formed on a semiconductor substrate. The ferroelectric memory device further comprises at least two adjacent ferroelectric capacitors disposed on the lower interlayer insulating layer, an interlayer insulation layer formed over the ferroelectric capacitors, leaving a top surface of the ferroelectric capacitors exposed, a patterned via etch-stop layer formed on the interlayer insulation layer, leaving the top surface of the capacitors exposed, an upper interlayer insulating layer formed on the patterned via etch-stop layer, and a plate line commonly connected to the at least two adjacent ferroelectric capacitors. Thus, integration of the ferroelectric memory device can be substantially increased.
申请公布号 US2003170919(A1) 申请公布日期 2003.09.11
申请号 US20030354651 申请日期 2003.01.29
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 SONG YOON-JONG;KIM KI-NAM;LEE SANG-WOO
分类号 H01L27/105;H01L21/8246;H01L27/115;(IPC1-7):H01L21/00 主分类号 H01L27/105
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