| 发明名称 |
Method for bonding and debonding films using a high-temperature polymer |
| 摘要 |
The invention relates to a semiconductor structure that is formed by delaminating a semiconductor substrate and by bonding the top section of the substrate to a transfer substrate. Delaminating is carried out by causing a polymer film to achieve greater adhesion that an embrittlement layer in the semiconductor substrate.
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| 申请公布号 |
US2003170424(A1) |
申请公布日期 |
2003.09.11 |
| 申请号 |
US20030412193 |
申请日期 |
2003.04.11 |
| 申请人 |
ROBERDS BRIAN;COLINGE CINDY;DOYLE BRIAN |
发明人 |
ROBERDS BRIAN;COLINGE CINDY;DOYLE BRIAN |
| 分类号 |
H01L21/762;(IPC1-7):B32B1/00 |
主分类号 |
H01L21/762 |
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