| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of depositing a rugged film by which the rugged film is formed under a low temperature condition. <P>SOLUTION: A source material of a 1st transparent conductive film 32 is evaporated by an evaporation system in a vacuum chamber where the temperature and the pressure of an atmosphere is set to a proper value, is grown into particles 32a having a proper size before the source material reaches a glass substrate 30 and is deposited on the substrate 30. After the deposition of the particles 32a, the source material is deposited on the substrate 30 to fill the gap among the particles 32a as particles (including molecules) having a size smaller than that of the particles 32a by lowering the temperature and the pressure. As a result, the 1st transparent conductive film 32 having ruggedness is deposited. A photoelectric converter is formed by successively stacking a photoelectric conversion film 33, a 2nd transparent conductive film 34 and a reflection film 35 on the 1st transparent conductive film 32. Because the particles 32a are grown before the particles 32a reach the substrate 30, it is unnecessary to make the temperature of the substrate 30 high. <P>COPYRIGHT: (C)2003,JPO |
