发明名称 RESIST MATERIAL AND PATTERN FORMING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a resist material capable of forming a pattern without scumming by exposure with UV of &ge;150 nm wavelength. <P>SOLUTION: The resist material using UV of &ge;150 nm wavelength as a light source for exposure comprises (A) an alkali-insoluble or slightly alkali- soluble high molecular compound which has an acidic functional group protected by an acid-labile group and becomes alkali-soluble when the acid-labile group is released, (B) an acid generator and (C) at least one nonionic fluorine compound selected from nonionic fluorine-containing organosiloxane compounds having only a perfluoroalkyl-containing siloxane bond and a polyoxyethylene type polyether bond. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003255523(A) 申请公布日期 2003.09.10
申请号 JP20020369997 申请日期 2002.12.20
申请人 SHIN ETSU CHEM CO LTD 发明人 KATO HIDETO;HIRANO SADANORI;FUJII TOSHIHIKO;YAMAGUCHI HIROMASA
分类号 G03F7/004;C07F7/08;G03F7/039;H01L21/027 主分类号 G03F7/004
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