| 摘要 |
<P>PROBLEM TO BE SOLVED: To equally and sufficiently illuminate an object to be illuminated in a backlight light source device, wherein a plurality of chip-shaped LEDs 14 obtained by bonding a LED light emitting diode 16 or 16' to the surface 15a of a chip insulation substrate 15 are arranged in intervals of an appropriate pitch to be mounted on a printed circuit board 13 provided on the rear face of the object to be illuminated. <P>SOLUTION: The insulation substrate 15 of each of the chip-shaped LEDs 14 is made transparent, while in the LED light emitting diode 16 or 16', a light emitting layer is formed on a surface parallel to a surface in the insulation substrate of the transparent substrate 16a. Each of the chip-shaped LEDs 14 is mounted on the printed circuit board 13 with a surface 15a of the insulation substrate 15 of the chip-shaped LED at a right angle or an almost right angle with respect to the surface of the printed circuit board. <P>COPYRIGHT: (C)2003,JPO |
