发明名称 HEAT CONDUCTIVE SHEET
摘要 PROBLEM TO BE SOLVED: To provide a heat conductive sheet capable of efficiently exhibiting the heat conductivity corresponding to the filling quantity of a heat conductive filler. SOLUTION: The heat conductive sheet is formed by compounding 30-80 vol.% heat conductive filler in the organic matrix such as a silicone gel. The heat conductive filler contains a spherical alumina powder in which the powder having≤30μm particle size is≤5 vol.% and also having a 50-80μm average particle size. In addition, the heat conductive filler contains the fine pulverous heat conductive filler having an average particle size of less than 5μm and the ratio of the fine pulverous heat conductive filler in the heat conductive filler is preferably 20-50 vol.%. The fine pulverous heat conductive filler is preferably a non-spherical alumina powder. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003253136(A) 申请公布日期 2003.09.10
申请号 JP20020059357 申请日期 2002.03.05
申请人 POLYMATECH CO LTD 发明人 TAKAHASHI KOUYA;ISHIHARA NATSUKO
分类号 C08J5/18;C08K3/22;C08K7/18;C08L101/00;H01L23/373;(IPC1-7):C08L101/00 主分类号 C08J5/18
代理机构 代理人
主权项
地址