发明名称 |
THIN FILM DEPOSITION APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a thin film deposition apparatus which can deposit a film in a correct area by preventing any thermal influence from an evaporation source to a mask. SOLUTION: The thin film deposition apparatus comprises a vacuum tank 2 and an evaporation unit 3 for an organic material, and a shutter 7 for controlling the film deposition is provided between a substrate 5 and the evaporation unit 3. A pipe line 71 to circulate a refrigerant 80 such as water is arranged inside a shutter body 70 of the shutter 7 for controlling the film deposition. The shutter body 70 is cooled by introducing the refrigerant 80 into the pipe line 71 from a refrigerant source 8 provided outside the vacuum tank 2. COPYRIGHT: (C)2003,JPO
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申请公布号 |
JP2003253433(A) |
申请公布日期 |
2003.09.10 |
申请号 |
JP20020055283 |
申请日期 |
2002.03.01 |
申请人 |
ULVAC JAPAN LTD |
发明人 |
NEGISHI TOSHIO;KIKUCHI HIROSHI |
分类号 |
H05B33/10;C23C14/24;H01L51/50;H05B33/14;(IPC1-7):C23C14/24 |
主分类号 |
H05B33/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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