发明名称 THIN FILM DEPOSITION APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a thin film deposition apparatus which can deposit a film in a correct area by preventing any thermal influence from an evaporation source to a mask. SOLUTION: The thin film deposition apparatus comprises a vacuum tank 2 and an evaporation unit 3 for an organic material, and a shutter 7 for controlling the film deposition is provided between a substrate 5 and the evaporation unit 3. A pipe line 71 to circulate a refrigerant 80 such as water is arranged inside a shutter body 70 of the shutter 7 for controlling the film deposition. The shutter body 70 is cooled by introducing the refrigerant 80 into the pipe line 71 from a refrigerant source 8 provided outside the vacuum tank 2. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003253433(A) 申请公布日期 2003.09.10
申请号 JP20020055283 申请日期 2002.03.01
申请人 ULVAC JAPAN LTD 发明人 NEGISHI TOSHIO;KIKUCHI HIROSHI
分类号 H05B33/10;C23C14/24;H01L51/50;H05B33/14;(IPC1-7):C23C14/24 主分类号 H05B33/10
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