首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
Header assembly for mounting to a circuit substrate
摘要
申请公布号
EP1049201(B8)
申请公布日期
2003.09.10
申请号
EP20000107911
申请日期
2000.04.13
申请人
FCI
发明人
ORTEGA, JOSE L.;STONER, STUART C.;RAISTRICK, ALAN
分类号
H01R13/652;H01R12/50;H01R13/6585;(IPC1-7):H01R12/16
主分类号
H01R13/652
代理机构
代理人
主权项
地址
您可能感兴趣的专利
ANTI-THEFT PROP
CURVED PIPE JACKING DEVICE
INDICATION IMPLEMENT FOR UPPER SURFACE OF CONCRETE
TENDON FIXING STRUCTURE AND BAND OF CAP FOR FIXING TENDON
WIG PIECE AND WIG
METHOD FOR WEAVING AND JOINING OF INDUSTRIAL WOVEN FABRIC AND ENDLESS INDUSTRIAL WOVEN FABRIC WOVEN AND JOINED BY THE SAME
LOCK DEVICE AND FITTINGS
CORE MATERIAL STRUCTURE OF BAR-SHAPED REINFORCING BODY AND CONSTRUCTION METHOD OF BAR-SHAPED REINFORCING BODY USING THIS CORE MATERIAL STRUCTURE
SUPPORTING STRUCTURE OF COLD-WATER/HOT-WATER SUPPLY PIPE
CORNER END MEMBER
METHOD FOR PRODUCING BULKY PULP
POLYESTER-BASED FIBER STRUCTURE
SYNTHETIC RESIN MOLDING MANUFACTURING METHOD
METHOD FOR PRODUCING BIODEGRADABLE FILM HAVING HONEYCOMB STRUCTURE
SPRAY FOR BLOCKING POLLEN
BORON-DOPED DIAMOND FILM, AND DIAMOND-COATED CUTTING TOOL
HIGH-STRENGTH COPPER ALLOY SHEET SUPERIOR IN BENDABILITY AND MANUFACTURING METHOD THEREFOR
RESIN COMPOSITION, FOAMED MOLDED FORM AND MULTILAYER MOLDED FORM
ELECTROCONDUCTIVE PASTE COMPOSITION
FLAME-RETARDANT POLYCARBONATE RESIN COMPOSITION AND ITS MOLDING
