| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a filmy adhesive which can be adhered to a copper member at≤250°C, has excellent heat resistance and reliability after adhered, and is optimal as an material for electronics. <P>SOLUTION: This filmy adhesive comprising a polyimide resin containing at least two imide rings in the molecule and having a glass transition point of 90 to 200°C, a curing compound, a curing agent for the curing compound, and a silane coupling agent is characterized by giving the cured film having an elastic modulus of 10 to 100 MPa at 210°C and a water absorption coefficient of≤3 wt.%. <P>COPYRIGHT: (C)2003,JPO</p> |
