| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electroplating method for plating an organic substrate which is applied to form a flip chip package with a solder. <P>SOLUTION: The organic substrate is provided. Then, a circuit pattern is laid out and at least one pad is installed on the organic substrate, and the surface of the substrate is covered with a solder mask layer, and the pad is exposed in a patterned state. Subsequently, a metal seed layer is formed on the surface of the substrate. The metal seed layer is formed by PVD, CVD, electroless plating using a copper catalyst or electroplating using the copper catalyst. A resist layer having at least one opening at the pad part is formed so that the metal seed layer is coated. Finally, a solder material is formed in the opening by an electroplating system, and the resist layer and the metal seed layer below the resist layer are removed. <P>COPYRIGHT: (C)2003,JPO |
