发明名称 FLOORING
摘要 PROBLEM TO BE SOLVED: To provide flooring reducible in warping while having excellent strength and hardness and reducing a dimensional change related to a temperature change and a humidity change. SOLUTION: In this flooring 3 with a surface finishing material 2 bonded to the surface of a woody board, the woody board is a fiberboard 1 formed by laminating a plurality of lint mats 1a, 1b, 1c formed by dispersing an adhesive in a lint aggregate, and then molding them by thermopressing, and the surface finishing material 2 is bonded to both front and rear faces of the woody board. The lint is obtained from either one of kenaf, jute, sisal, oil coconut and coconut. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003253869(A) 申请公布日期 2003.09.10
申请号 JP20020054579 申请日期 2002.02.28
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 SUGAWARA AKIRA;OKUDAIRA YUZO;UMEOKA KAZUAKI;ONISHI KENJI;ANDO HIDEYUKI
分类号 B27M3/04;B27N3/04;E04F15/04;(IPC1-7):E04F15/04 主分类号 B27M3/04
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