发明名称 ONE-PACK MOISTURE-CURING URETHANE RESIN-BASED LEVELING MATERIAL AND METHOD FOR LEVELING USING THE SAME
摘要 PROBLEM TO BE SOLVED: To obtain a one-pack moisture-curing urethane-based leveling material by which a conventional leveling method is rationalized. SOLUTION: The leveling material comprises an isocyanate-terminal urethane prepolymer, a nonhollow filler and a hollow filler having a particle diameter larger than that of the nonhollow filler. The isocyanate-terminal urethane prepolymer is obtained by reacting a polyol with an isocyanate compound. A polyol mixed with 25-100 mass % of a polyoxypropylene polyol having≤0.035 milliequivalent/g unsaturation degree and 1,500-20,000 number-average molecular weight (Mn) is used as the polyol. The isocyanate content of the isocyanate- terminal urethane prepolymer is preferably 1-10%. Preferably the average particle diameter of the nonhollow filler is 0.01-8μm and the average particle diameter of the hollow filler is 20-200μm. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003253237(A) 申请公布日期 2003.09.10
申请号 JP20020055293 申请日期 2002.03.01
申请人 KONISHI CO LTD;YUKA SANSHO KK 发明人 KOGA SHIGEYUKI;ARISAWA AKIZO;KANO CHIAKI;MIYAMOTO NOBUYUKI
分类号 C08G18/10;C08G18/48;C09J11/00;C09J175/08;C09J175/14;(IPC1-7):C09J175/08 主分类号 C08G18/10
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