发明名称 Method for mechanicaly fixing components on a board and device for applying this method
摘要 <p>The mechanical fixing method uses an adhesive (17) which is injected into the gap (22) between the electrical component (11) and the surface of the printed circuit board (10) after electrically connecting the component electrical contacts (16) with the corresponding contact zones (15) of the printed circuit board. The adhesive is injected via a needle around the edge (19) of the electrical component and provides simultaneous encapsulation of the contact connections. An Independent claim for a mechanical connection between an electrical component and a printed circuit board is also included.</p>
申请公布号 EP1014776(B1) 申请公布日期 2003.09.10
申请号 EP19980124651 申请日期 1998.12.24
申请人 NOKIA CORPORATION 发明人 RICHTER, LUTZ
分类号 H05K3/30;H05K13/04;(IPC1-7):H05K13/04 主分类号 H05K3/30
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