| 摘要 |
A method for attaching an electronic die 10' to a substrate 12' includes fixing the die to the substrate, interconnecting the electronic die to an at least one bonding pad 38 on the substrate to form an electrical connection, coating the interconnects and the electronic die with an electrically insulating coating, and covering the electronic die with a low temperature melting metal 60. The substrate 12' preferably comprises a base 34 with an upstanding wall 32 to form a cavity in which the die is enclosed with the low temperature melting metal, which is preferably a solder alloy containing Bi. The cavity is covered with a lid 62. The die 10' may be fixed to the substrate in the first step using a low temperature solder bead or a vacuum (figure 5). |
